Home Just In Capgemini to expand its semiconductor design services in Europe

Capgemini to expand its semiconductor design services in Europe


Capgemini has announced its plans to open semiconductor design services centers across Europe to support Intel’s strengthened program of chip manufacturing and ecosystem design services.

As a founding member of the new Intel Foundry Services (IFS) Accelerator Design Services Alliance, Capgemini, together with IFS and other IFS Accelerator ecosystem partners, aims to provide a full range of leading-edge chip design, manufacturing and semiconductor ecosystem services to IFS customers. The initiative will help strengthen the production capacity of next-generation semiconductors in Europe to better support regional companies and build resilience in the European semiconductor supply chains, in line with the strategic goals of the European Chips Act.

“In collaboration with Intel and the alliance partners, Capgemini is driving the next generation of semiconductor innovation, scaling its silicon engineering expertise in step with the new Intel Foundry Services business,” said William Rozé, CEO of Capgemini Engineering and Group Executive Board Member. “Expanding access to leading edge chip design for Intel Foundry Services customers, we will contribute to make services more readily available within Europe and to help meet the fast-growing market demand in the region.”

Capgemini is planning the formation of design centers in Europe, to provide time zone-friendly resources and support for European customers of IFS. Initial centers in France and Portugal will bring together chip design and embedded software teams.

The design centers will offer silicon engineering expertise gained from over 15 years of experience in chip design across all markets and technology domains, from 5G, to hyperscaler, automotive, industrial, IoT, networking, wireless connectivity, Artificial Intelligence/Machine Learning, medical, defense, etc., as well as deep experience working with Intel’s latest process and packaging technologies. The highly skilled teams will be able to take on the most challenging sub-7nm chip designs[1] for the latest generation of high-performance and ‘intelligent’ products for any market.

Silicon engineering services available to IFS customers will include:
• End-to-end chip design, including frontend design & verification (digital and/or analog) and backend (physical design) services to support sovereignty and security
• Process migration services, to help customers port existing IP or SoC (System on a chip) designs from other industry leading fabs for manufacturing in IFS nodes and processes

• Post-silicon validation, to help clients validate the functionality, performance, and power efficiency of their designs after manufacturing
• Embedded software, board, and system hardware support, to help customers tailor their chips for product development for end markets. Product engineering services are also available.


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